发明名称 |
SILVER CONDUCTIVE FILM AND PRODUCTION METHOD THEREOF |
摘要 |
Provided is a silver conductive film, a thin film of silver comprising a sintered layer of silver particles having a mean particle size D TEM of at most 100 nm. Its specific resistance is at most 5 µ©·cm, the ratio of the voids in the sintered layer is at most 3/µm 2 , and the film has a texture structure with a surface roughness Ra of from 10 to 100 nm. The silver conductive film having such a texture structure may be produced according to a production process comprising a step of applying a silver particle dispersion of silver particles having a mean particle size D TEM of at most 100 nm dispersed in a non-polar or poorly-polar liquid organic medium having a boiling point of from 60 to 300°C, onto a substrate to form a coating film thereon, and thereafter baking the coating film. |
申请公布号 |
EP1983528(B1) |
申请公布日期 |
2016.08.03 |
申请号 |
EP20070706716 |
申请日期 |
2007.01.09 |
申请人 |
DOWA ELECTRONICS MATERIALS CO., LTD. |
发明人 |
SATO, KIMITAKA;HISAEDA, YUTAKA;OKANO, TAKU;OGI, KOZO |
分类号 |
H01B5/14;C23C18/08;H01B13/00;H01L31/0224;H01L31/0392 |
主分类号 |
H01B5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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