发明名称 SILVER CONDUCTIVE FILM AND PRODUCTION METHOD THEREOF
摘要 Provided is a silver conductive film, a thin film of silver comprising a sintered layer of silver particles having a mean particle size D TEM of at most 100 nm. Its specific resistance is at most 5 µ©·cm, the ratio of the voids in the sintered layer is at most 3/µm 2 , and the film has a texture structure with a surface roughness Ra of from 10 to 100 nm. The silver conductive film having such a texture structure may be produced according to a production process comprising a step of applying a silver particle dispersion of silver particles having a mean particle size D TEM of at most 100 nm dispersed in a non-polar or poorly-polar liquid organic medium having a boiling point of from 60 to 300°C, onto a substrate to form a coating film thereon, and thereafter baking the coating film.
申请公布号 EP1983528(B1) 申请公布日期 2016.08.03
申请号 EP20070706716 申请日期 2007.01.09
申请人 DOWA ELECTRONICS MATERIALS CO., LTD. 发明人 SATO, KIMITAKA;HISAEDA, YUTAKA;OKANO, TAKU;OGI, KOZO
分类号 H01B5/14;C23C18/08;H01B13/00;H01L31/0224;H01L31/0392 主分类号 H01B5/14
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