Semiconductor package structure and method for forming the same

摘要

A semiconductor package structure and method for forming the same are provided. The semiconductor package structure includes a substrate (200) and the substrate has a front side and a back side. The semiconductor package structure includes a through silicon via (TSV) interconnect structure (230) formed in the substrate; and a first guard ring doped region (242) and a second guard ring doped region (244) formed in the substrate, and the first guard ring doped region and the second guard ring doped region are adjacent to the TSV interconnect structure.