| 摘要 |
A cooling system (206) for use with a power electronics assembly (200) comprising an array (202) of line-replaceable units (204) is provided. The cooling system (206) includes a first manifold (210) coupled in flow communication with the array (202) of line-replaceable units (204), and a fluid supply (208) coupled in flow communication with the first manifold (210). The fluid supply (208) is configured to channel cooling fluid towards the first manifold (210) such that the cooling fluid (208) is discharged towards the line-replaceable units (204) in the array (202) substantially simultaneously. |
