| 摘要 |
A wafer processing laminate is provided comprising a support (2), a temporary adhesive layer (3) on the support (2), and a wafer (1) laid on the temporary adhesive layer. The temporary adhesive layer has a trilayer structure consisting of a first bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the circuit-forming front surface of the wafer, a second bond layer (B) of thermosetting modified siloxane polymer which is laid on the first bond layer, and a third bond layer (A') of thermoplastic organosiloxane polymer which is laid on the second bond layer and releasably bonded to the support. |
