发明名称 |
METHOD AND ZONE FOR SEALING BETWEEN TWO MICROSTRUCTURE SUBSTRATES |
摘要 |
The invention concerns a sealing zone between two microstructure substrates. Said sealing zone comprises at least the following parts: on a first wafer level (20), a lower edging (22A) made of an adhesive material capable of causing the first substrate (20) to adhere to a sealing material, said sealing material being adapted to spontaneously diffuse jointly with the material of the second wafer level (30); on said lower edging (22A), a layer of said sealing material; and on said layer of sealing material, a protuberance (36) formed on said second wafer level (30) containing a certain amount of sealing material. The invention is applicable to microstructures comprising vacuum-operated components. |
申请公布号 |
EP1467947(B1) |
申请公布日期 |
2016.07.27 |
申请号 |
EP20020806329 |
申请日期 |
2002.12.17 |
申请人 |
COMMISSARIAT À L'ÉNERGIE ATOMIQUE ET AUX ÉNERGIESALTERNATIVES |
发明人 |
DIEM, BERNARD;CAPLET, STÉPHANE;DELAYE, MARIE-THÉRÈSE |
分类号 |
B81B7/00;B81C3/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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