发明名称 ウェーハ貼着装置
摘要 PROBLEM TO BE SOLVED: To shorten the time required to carry out a wafer attached with a sheet which is airtightly adhered onto a stage, thereby improving the efficiency of a series of operations from carry-in to carry-out of the wafer.SOLUTION: A stage (602) is provided with: a first holding face (652) for holding an outer peripheral region of a sheet (S); a second holding face (653) for holding an inner region of the sheet (S) on an inner bottom face of a recess (622) arranged correspondingly to the inner region of the sheet (S); a lateral face (654) for defining, together with the sheet (S) and the second holding face (653), a closed space (657) on an inner peripheral face of the recess; and a suction port (656) for sucking air from the closed space (657). Air suction from the suction port (656) causes the second holding face (653) to hold the sheet (S) held on the first holding face (652), while stretching the sheet (S). The sheet (S) held on the second holding face (653) is then peeled off by air supply from the suction port (656).
申请公布号 JP5957330(B2) 申请公布日期 2016.07.27
申请号 JP20120171154 申请日期 2012.08.01
申请人 株式会社ディスコ 发明人 桑名 一孝;吉田 悠太
分类号 H01L21/683;H01L21/304;H01L21/677 主分类号 H01L21/683
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