| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a package substrate for mounting an optical semiconductor element which can achieve reduction of lead time, improvement of productivity by reduction of the number of used material and manufacturing steps, and cost reduction, and to provide a method of manufacturing an optical semiconductor device using the package substrate.SOLUTION: A method of manufacturing a package substrate for mounting an optical semiconductor element comprises, on a wiring board, a thermosetting resin composition layer for reflecting light, which is formed with two or more recesses serving as optical semiconductor element mounting regions. The method of manufacturing the package substrate for mounting the optical semiconductor element is constituted so as to form the thermosetting resin composition layer for the reflecting light by transfer molding. |
