金属成形体とパワー半導体の間に、太径ワイヤ又はストリップとのボンディングに使用する接続部を形成する方法

摘要

The invention relates to a method for connecting a power semi-conductor chip having upper-sided potential surfaces to thick wires or strips, consisting of the following steps: Providing a metal moulded body corresponding to the shape of the upper-sided potential surfaces, applying a connecting layer to the upper-sided potential surfaces or to the metal moulded bodies, and applying the metal moulded bodies and adding a material fit, electrically conductive compound to the potential surfaces prior to the joining of the thick wire bonds to the non-added upper side of the moulded body.