| 摘要 |
PROBLEM TO BE SOLVED: To improve manufacturing quality of a semiconductor device and to improve manufacturing throughput.SOLUTION: A substrate processing apparatus includes a placement stage on which a transportation container which houses a plurality of substrates is placed, a process chamber which applies a heating process to the substrate, a transportation chamber which is provided to adjoin the process chamber, beside the placement stage, and contains a transportation robot for transporting the substrate between the placement stage and the process chamber, a substrate placement part which is provided to the transportation chamber and is configured to stack the substrate having been processed in the process chamber, and a cooling part which is provided to the transportation chamber and supplies the stacked substrates with the cooling gas from the side of the substrate. |
