| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting method and a cutting device of a semiconductor substrate capable of efficiently providing a chip with stable quality.SOLUTION: A cutting method of a semiconductor substrate comprises: a step (step S10) of forming a modified region along a cutting line L in a depth from a surface of the wafer W of approximate 60 μm to approximate 80 μm by irradiating the inside of the wafer W with laser beam; and a step (step S12) of grinding the wafer W from the rear surface to a reference surface being approximate 50 μm deep from the surface of the wafer W. In the step S12, a crack is developed in the modified region between the reference surface and the surface of the wafer W. The method further comprises: a step (step S14) for removing a work-affected layer formed on the rear surface of the wafer W as a result of the grinding and applying mirror finishing to the rear surface of the wafer W; a step (step S16) of applying an expanding tape to the rear surface of the wafer W; and a step (step S18) of breaking the wafer W along the cutting line and dividing it into chips T when the expanding tape is expanded outward. |
