| 摘要 |
The purpose of the present invention is to suppress the occurrence of a brazing filler metal stain without deteriorating the joint performance between a metal plate and a ceramic substrate and increase the solder joint performance of a semiconductor chip. A method for manufacturing a substrate for a power module, the substrate being formed by laminating and brazing, to one surface of a ceramic substrate, a metal plate punched out by pressing a metal stock plate, wherein the heights of burrs of the metal plate are set to 0.021 mm or less, the thickness of a fracture surface is set to 0.068 mm or more, and the metal plate is laminated and brazed onto the ceramic substrate such that the surface thereof on the side on which the burrs are formed is placed on top of the one surface of the ceramic substrate. |
