发明名称 |
FRAME BASED PACKAGE FOR FLIP-CHIP LED |
摘要 |
A hollow frame is configured to surround the periphery of a substantially self-supporting flip-chip light emitting device. The frame may be shaped to also contain a wavelength conversion element above the light emitting surface of the light emitting device. The lower surface of the light emitting device, which is exposed through the hollow frame, includes contact pads coupled to the light emitting element for surface mounting the light emitting module on a printed circuit board or other fixture. The flip-chip light emitting device may include a patterned sapphire substrate (PSS) upon which the light emitting element is grown, the patterned surface providing enhanced light extraction from the light emitting element, through the patterned sapphire substrate. |
申请公布号 |
EP3044809(A1) |
申请公布日期 |
2016.07.20 |
申请号 |
EP20140786296 |
申请日期 |
2014.08.28 |
申请人 |
KONINKLIJKE PHILIPS N.V. |
发明人 |
STOCKMAN, STEPHEN ANDREW;DE SAMBER, MARC ANDRE;SHCHEKIN, OLEG BORISOVICH;SWEEGERS, NORBERTUS ANTONIUS MARIA;HAQUE, ASHIM SHATIL;MARTYNOV, YOURII |
分类号 |
H01L25/075;H01L33/00;H01L33/48;H01L33/50;H01L33/58;H01L33/60 |
主分类号 |
H01L25/075 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|