| 摘要 |
Provided is a semiconductor device such that, when a first sealing member that covers a semiconductor chip is disposed between a printed substrate and an insulating substrate on which the semiconductor chip is mounted, and the whole is sealed with a second sealing member, it is possible to prevent detachment of the second sealing member, thus increasing reliability. The semiconductor device includes an insulating substrate (11) on which is mounted a main circuit part including a semiconductor chip, a printed substrate (16) wherein a conductive connection member connected to the semiconductor chip is disposed on the surface opposing the insulating substrate, a first sealing member (21) that seals so as to enclose the semiconductor chip between the opposing surfaces of the insulating substrate and printed substrate, and a second sealing member (24) that covers the whole excepting a bottom portion of the insulating substrate, the semiconductor device having sealing region regulation rod portions (22Aa) to (22Ad) and (22Ba) to (22Bd) disposed in an outer peripheral portion of a sealing region of the first sealing member and connected between the insulating substrate and printed substrate, wherein the heat resistance temperature of the first sealing member is set to be higher than the heat resistance temperature of the second sealing member. |
