发明名称 |
MOLDING AND OVERMOLDING COMPOSITIONS FOR ELECTRONIC DEVICES |
摘要 |
The present invention relates to molding and overmolding compositions for delicate components. More particularly the invention relates to compositions for low pressure molding and overmolding, making these compositions particularly well suited for electronic devices. The molding and overmolding composition is suitable for low pressure injection molding processes, particularly at 0.5 to 200 bars at 70° C. to 240° C. |
申请公布号 |
EP2914660(A4) |
申请公布日期 |
2016.07.20 |
申请号 |
EP20130850880 |
申请日期 |
2013.10.23 |
申请人 |
HENKEL IP & HOLDING GMBH |
发明人 |
CAIN, CYNTHIA L.;PAUL, CHARLES W.;DEJESUS, MARIA CRISTINA BARBOSA |
分类号 |
C08L33/04;C08J5/00;C08K5/3475;C08L33/12;C08L101/00 |
主分类号 |
C08L33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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