| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which provides a patterned cured film that exhibits satisfactory sensitivity and, when cured at low temperature around 230°C, satisfactory mechanical characteristics and heat resistance.SOLUTION: The photosensitive resin composition contains (a) a polybenzoxazole precursor having a structural unit represented by the specified general formula (I), where U and V each represent a divalent organic group and V has a C1-C30 aliphatic chain structure, (b) a polyimide soluble in an organic solvent and an alkaline solution, (c) a compound reactive with the (a) and (b) components under heating, (d) a compound generating an acid upon exposure to an actinic ray, and (e) a solvent. The content of the (a) component is 30-70 pts.mass relative to 100 pts.mass of the total content of the (a) component and the (b) component. |
