发明名称 半導体装置
摘要 A first photosensitive organic insulating film (PO1) formed in contact with a passivation film (PL) covers the entire circumference of a stepped portion (TRE) at a surface of the passivation film PL formed by a topmost conductive layer (TCL) and has an outer circumferential edge (ED1) positioned, along the entire circumference, on the outer circumferential side with respect to the stepped portion (TRE). This can prevent the first photosensitive organic insulating film (PO1) from peeling off the passivation film (PL).
申请公布号 JP5955963(B2) 申请公布日期 2016.07.20
申请号 JP20140525613 申请日期 2012.07.19
申请人 ルネサスエレクトロニクス株式会社 发明人 冨田 和朗
分类号 H01L21/3205;H01L21/312;H01L21/60;H01L21/768;H01L21/822;H01L23/522;H01L27/04 主分类号 H01L21/3205
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