| 摘要 |
PROBLEM TO BE SOLVED: To provide an MEMS module which can be reduced in thickness, and a method of manufacturing the same.SOLUTION: An MEMS module has: a first MEMS element having a first substrate having a detection part for detecting a prescribed mechanical quantity and first wiring at one face, and a second substrate having second wiring and laminated on one face of the first substrate so as to cover the first wiring; a second MEMS element mounted to a face at a side of the second substrate opposite to the first substrate; and a sealing substrate which forms a first sealing space for sealing the second MEMS element at a face at a side of the second substrate opposite to the first substrate. The second MEMS element is electrically connected to an external connecting terminal which is formed in a region exposed from the sealing substrate of the second substrate via the second wiring and the first wiring. |
