| 摘要 |
The present invention relates to a vacuum bonding apparatus capable of bonding with constant pressure, in which actual pressure applied to components to be bonded is controlled to be uniform with respect to all surfaces such that same pressure is applied to both of the components to be bonded, thereby bonding the components while maintaining gap uniformity. The vacuum bonding apparatus capable of bonding with the constant pressure according to the present invention includes: a vacuum chamber for maintaining an inner space thereof in a vacuum state; a lower supporting panel unit mounted inside the vacuum chamber for supporting a lower component between both components to be bonded from a lower side of the lower component; a middle panel mounted under the lower supporting panel unit in the inner space of the vacuum chamber; a pressure sensing unit mounted between the middle panel and the lower supporting panel unit, and mounted on at least three spots differently located from each other on the lower supporting panel unit for sensing pressure to which the lower supporting panel unit downwardly applies; a horizontal degree adjusting unit mounted at a plurality of spots of a surface under the middle panel, and being independently lifted through a bottom wall of the vacuum chamber for adjusting a horizontal degree of the middle panel; an upper supporting panel mounted at an upper side of the lower supporting panel unit in the vacuum chamber for applying pressure on an upper component between the both components to be bonded toward the lower supporting panel unit in a state of supporting from an upper side the upper component; and a control unit in which a value of pressure applied on the every spot of the lower supporting panel unit according to pressurizing of the upper supporting panel is received from the pressure sensing unit for controlling the horizontal degree adjusting unit to apply same pressure on the every spot of the lower supporting panel unit. |
