发明名称 放熱器、積層型電子デバイス、及び電子機器。
摘要 PROBLEM TO BE SOLVED: To improve a heat radiation effect of a radiator for cooling a semiconductor device.SOLUTION: A heat conductive plate part 152 of a radiator 150 effectively radiates heat because it is wide in a contact area contacting with air, that is, a heat radiation area. In addition, since a coupling part 164 is formed in a bellows-like shape to make a plate-like part 166 function as a cooling fin, the coupling part 164 is wide in the contact area contacting with air, that is, the heat radiation area, and thus, effectively radiates heat.
申请公布号 JP5953734(B2) 申请公布日期 2016.07.20
申请号 JP20110278755 申请日期 2011.12.20
申请人 富士通株式会社 发明人 岡田 晃;金崎 克己;宮▲崎▼ 雄英
分类号 H01L23/40;H01L23/36;H01L23/467;H05K7/20 主分类号 H01L23/40
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