| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device with high reliability, to provide a method of manufacturing the same, and to provide a circuit board and an electronic apparatus.SOLUTION: An electrode 114 is electrically connected to an integrated circuit 112. A resin layer 118 is formed on the surface of a semiconductor substrate 110 on which the electrode 114 is formed, so as to keep away from the electrode 114. Wiring 122 is electrically connected to the electrode 114 and has a first portion 150 formed at the boundary between a side surface 121 and a top surface 120 of the resin layer 118 and a second portion 152 that is connected to the first portion 150 and is formed on the top surface 120 of the resin layer 118. The first portion 150 is formed wider than the second portion 152. An external terminal 124 is electrically connected to the wiring 122. |
