X-RAY INSPECTION APPARATUS FOR INSPECTING SEMICONDUCTOR WAFERS

摘要

A sample support for a semiconductor wafer comprising: a generally planar support surface having an imaging area configured to support a semiconductor wafer; and at least one depression in the imaging area of the support surface in fluid communication with a vacuum port, wherein the sample support has a thickness in a direction normal to the planar support surface and wherein the rate of change of thickness of the sample support has a maximum value of no more than 5% per millimetre of travel across the imaging area. The benefit of a sample support of this type is that it does not give rise to significant contrast changes in x-ray images resulting from x-rays that have passed through the support.