发明名称 Modular socket panel and layer module for modular socket panel
摘要 A modular socket panel comprising: a bottom layer 20 adapted to be fixed to an embedded case in a wall and adapted to be electrically connected to a power supply provided by the embedded case, and a surface layer 24 adapted to be directly or indirectly connected to the bottom layer in a non-fastening manner (preferably sliding, pull and plug, or snap fitting). The surface layer provides a power socket 42, which is electrically connected to the bottom layer. The modular socket panel disclosed in the present invention preferably enables a user to mount a middle layer 22 and the surface layer onto the bottom layer or remove the middle layer and surface layer from the bottom layer without any tool, and also enables the user to mount different middle layers in the modular socket panel when needed to implement different functions, such as network connection and USB interface. Preferably the middle layer comprises an environmental sensor (temperature, humidity etc.) or a network adapter (powerline, Ethernet, wireless access etc.)
申请公布号 GB2534011(A) 申请公布日期 2016.07.13
申请号 GB20150019547 申请日期 2015.11.05
申请人 Sipomac Technology Company Limited 发明人 Sai Man Wang;Sek Un Fong
分类号 H01R13/514;H01R27/00 主分类号 H01R13/514
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