| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a cured product having less thermal decomposition (weight loss) even when placed in a high temperature of 200°C or more, for example, 200-250°C for a long period, excellent adhesion to a CuLF or an Ag plating film, good mechanical strength in a high temperature and excellent reliability.SOLUTION: The resin composition comprises: (A) a cyanate ester compound having two or more cyanate groups in one molecule; (B) a phenolic compound having two or more phenolic hydroxyl groups in one molecule; (C) an inorganic filler; (D) a compound represented by a general formula (3) (where, Rand Rare independent and 1-3C alkyl groups, and d is an integer of 0-2); (E) a material formed by supporting molybdic acid metal salt on an inorganic carrier; and (F) a hydrotalcite-like compound and/or the calcined product of the hydrotalcite-like compound. A molar ratio of a phenolic hydroxyl group in (B) the phenolic compound to a cyanate group in (A) the cyanate ester compound is 0.1-0.4. |
