| 摘要 |
PROBLEM TO BE SOLVED: To provide a die bonder or a bonding method with high reliability, capable of reliably mounting a die on an intermediate stage and reliably picking up it from the intermediate stage.SOLUTION: A die is picked up from a wafer by a pickup head, mounted on the intermediate stage, picked up by a bonding head from the intermediate stage and bonded to a substrate or the die already bonded, and when the die is mounted on the intermediate stage, the intermediate stage is lowered so as to buffer load due to the mounting. |
