| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition that provides a cured product having a low dielectric constant and a dielectric tangent, and that provides a cured product in which formability at a normal press molding temperature is excellent, and that has excellent heat resistance and adhesiveness, in which foreign matter discovery is easy.SOLUTION: A curable resin composition includes a polyphenylene ether, wherein an average phenolic hydroxyl group number per one molecule of the polyphenylene ether is at least 0.3, the polyphenylene ether includes at least 75 mass% of a polyphenylene ether component in which a number average molecule weight exceeds 8,000 based on the total amount of the polyphenylene ether, a resin flow amount of the curable resin composition when being cured is at least 0.3% and at most 15%, and the curable resin composition provides a cured product in which a dielectric tangent at 1GHz is at most 0.005 and a glass transformation temperature is at least 170°C. |
