发明名称 |
Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method |
摘要 |
An osseointegration method of integrating bone and implant material includes, for integrating the bone and the implant material shortly and easily, a drilling step of drilling a hole in a bone 51 or implant material 52 through to a junction of the bone 51 and the implant material 52 by applying a laser beam to the bone 51 or the implant material 52, and an integrating step of integrating the bone 51 and the implant material 52 by applying a laser beam to the junction of the bone 51 and the implant material 52 through the hole drilled at the drilling step. |
申请公布号 |
EP2596764(B1) |
申请公布日期 |
2016.07.13 |
申请号 |
EP20130153435 |
申请日期 |
2007.08.21 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION;NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY |
发明人 |
KANAOKA, MASARU;OGITA, TAIRA;MURAI, TOORU;TADANO, SHIGERU;TODOH, MASAHIRO |
分类号 |
A61B17/88;A61B17/00;A61B17/16;A61B18/00;A61B18/20;A61B18/22;A61C1/00;A61C8/00;A61F2/00;A61F2/30;A61F2/46;B23K26/00;B23K26/32;B23K26/323;B23K26/324;B23K26/386;B23K26/402;B23K103/00;B29C65/00;B29C65/16;B29C65/82 |
主分类号 |
A61B17/88 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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