发明名称 Laser processing apparatus, osseointegration method, implant material, and implant-material fabrication method
摘要 An osseointegration method of integrating bone and implant material includes, for integrating the bone and the implant material shortly and easily, a drilling step of drilling a hole in a bone 51 or implant material 52 through to a junction of the bone 51 and the implant material 52 by applying a laser beam to the bone 51 or the implant material 52, and an integrating step of integrating the bone 51 and the implant material 52 by applying a laser beam to the junction of the bone 51 and the implant material 52 through the hole drilled at the drilling step.
申请公布号 EP2596764(B1) 申请公布日期 2016.07.13
申请号 EP20130153435 申请日期 2007.08.21
申请人 MITSUBISHI ELECTRIC CORPORATION;NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY 发明人 KANAOKA, MASARU;OGITA, TAIRA;MURAI, TOORU;TADANO, SHIGERU;TODOH, MASAHIRO
分类号 A61B17/88;A61B17/00;A61B17/16;A61B18/00;A61B18/20;A61B18/22;A61C1/00;A61C8/00;A61F2/00;A61F2/30;A61F2/46;B23K26/00;B23K26/32;B23K26/323;B23K26/324;B23K26/386;B23K26/402;B23K103/00;B29C65/00;B29C65/16;B29C65/82 主分类号 A61B17/88
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