| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component built-in wiring board which achieves high reliability in mechanical strength and moisture resistance and enables a wiring pattern to be formed on an entire surface of a multilayer plate thereby improving the integration density.SOLUTION: An electronic component built-in wiring board includes: an electronic component connected with a first wiring pattern; a first insulation substrate positioned on a surface of the first wiring pattern which is located at the side where the electronic component exists and having a thickness which is set so that the electronic component penetrates through the first insulation substrate in a height direction, the first insulation substrate including a reinforcement material and made of a resin; a core substrate including an insulation substrate including a reinforcement material, a second wiring pattern which is provided on a first surface of the insulation substrate so as not to sink in the insulation substrate in a thickness direction, a third wiring pattern provided on a second surface, and an opening part in which the electronic component may enter in the height direction, the core substrate which is positioned with the first surface side facing the first insulation substrate so that the electronic component enters into the opening part in the height direction; and a second insulation substrate positioned on the second surface of the core substrate. A resin is oozed from the first insulation substrate to be positioned in a gap between the opening part and the electronic component. |
