发明名称 金属充填装置、金属充填方法
摘要 PROBLEM TO BE SOLVED: To realize effective metal filling while inhibiting leakage of a metal for filling when a pressing pressure is applied for filling the metal and also inhibit the metal for the filling from adhering to a rear surface of a substrate and contaminating a surrounding area.SOLUTION: A metal filling apparatus 1 includes: a holding base 4 holding a substrate K; a pressing member P provided so as to face the holding base 4; a pressing mechanism 5 driving the pressing member P so that the pressing member P may be pressed against the held substrate K; and a heating/cooling mechanism 6 melting a solid metal for filling M supplied onto the substrate K. The pressing member P includes a metal sealing part 7 which seals the metal for the filling M in a solid or melting state at a region on the substrate K when the pressing member P is pressed against the substrate K.
申请公布号 JP5950648(B2) 申请公布日期 2016.07.13
申请号 JP20120066887 申请日期 2012.03.23
申请人 住友精密工業株式会社 发明人 山口 征隆
分类号 H01L21/3205;H01L21/288;H01L21/768;H01L23/14;H01L23/522 主分类号 H01L21/3205
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