| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for electric and electronic parts having high electric conductivity and strength and excellent in a stress-relaxing characteristic and bending workability and excellent in a thermal peeling resistance of the tin-plating.SOLUTION: The copper alloy is composed, by mass%, of 0.01-0.2% Fe, 0.02-0.15% P, 0.05-0.2% Mg, 0.001-0.2% Sn and 0.05-1.0% Zn and the balance Cu with inevitable impurities, and further, S is ≤0.005 mass%, and contents of Fe, Mg and P satisfy the following formulas (1) and (2): (1) 2.5≤([Fe]+[Mg])/[P]≤8.0; and (2) [Mg]/[Fe]≥0.85 [Fe], wherein [Mg] and [P] represent respectively contents of Fe, Mg and P. |
