| 摘要 |
PROBLEM TO BE SOLVED: To provide a placing table of an electronic component, enabling certain placement to substrates or dies of different size; and a die bonder equipped with the table.SOLUTION: A placing table of an electronic component is a placing table 31 composed of a body portion; and a chuck portion formed on one surface of the body portion, and placing an electronic component on a surface of the chuck portion. The chuck portion is formed by a porous member. A vacuum introduction hole 311 for leading a vacuum into the inside is formed on a part of the body portion, and a buffer plate 33 formed with a groove 333 corresponding to the electronic component sucked on a suction surface of the chuck portion is provided between the body portion and the chuck portion. Through the groove of the buffer plate, by the vacuum led to the vacuum introduction hole, the electronic component is sucked and placed on the surface of the chuck portion made from the porous member. The placing table of the electronic component is adapted to an alignment stage 31 for configuring a die bonder, and furthermore, a substrate carrying pallet. |
