| 摘要 |
A radiation sensor device (10) comprising:
an integrated circuit chip (12) including a radiation sensor (14) on a surface of the integrated circuit chip; and
a cap (16) attached to the integrated circuit chip spaced from and covering the radiation sensor, at least one of the cap and the integrated circuit chip having at least a portion proximate the radiation sensor transparent to the radiation to be sensed, in which the cap and integrated circuit chip with the radiation sensor are disposed in an encapsulant (32), wherein the encapsulant includes a recess, and wherein the transparent portion is exposed in the recess. |
