| 摘要 |
Provided is a protective membrane forming film that has high strength of the protective membrane, contributes to an increase in production characteristics for a chip provided with a protective membrane, and can obtain a highly reliable chip provided with a protective membrane. The protective membrane forming film is for forming a protective membrane that protects a semiconductor chip, and contains an epoxy-based heat-curable component containing an epoxy compound of which the cured product has a glass transition temperature of at least 220°C. |
