SOLID-STATE IMAGING DEVICE

摘要

A solid-state image pickup device comprising: a multilayer wiring board 2 having an opening portion 21; a spacer 3 covered with a conductive film 32, and fixed to the multilayer wiring board 2 in a state of making the conductive film 32 face contact with a reference potential electrode exposed into the opening portion 21 of the multilayer wiring board 2; a solid-state image pickup element 4 fixed to the spacer 3 in a state of face contact with the conductive film 32 of the spacer 3, and arranged in the opening portion 21; and an optical element 5 fixed at a position opposing the solid-state image pickup element 4 via the spacer 3, and transmitting light into the opening portion.