METHOD AND APPARATUS FOR MEASURING SURFACE PROPERTIES OF POLISHING PAD

摘要

Provided are a method and an apparatus for measuring surface description of a polishing pad which can measure surface description of a polishing pad reflecting chemical mechanical polishing (CMP) performance by applying a laser beam to the polishing pad at a plurality of incident angles. The method for measuring surface description of a polishing pad (2) irradiates a laser beam to a surface of the polishing pad (2), and performs Fourier transform by receiving light reflected in the surface of the polishing pad (2) to measure surface description of the polishing pad (2). The laser beam is applied to the polishing pad (2) at the incident angles.