| 摘要 |
The problem addressed by the present invention is to provide an image processing device, which is capable of extracting a solder portion easily from an image, and an electronic component mounting machine. This image processing device (6) is provided with an illumination unit (61) for illuminating with an illumination light (612) an image capture area (G4) of a substrate (Bf), an image capture unit (60) for performing image capture of the image capture area (G4) which has been illuminated by the illumination light (612), and an image processing unit (62) for processing an image (g4) that has been acquired by the image capture. The illumination unit (61) illuminates with the illumination light (612) from a direction perpendicular with respect to the image capture area (G4). The image capture area (G4) has a solder portion (Eb) in which solder which has been applied to the substrate (Bf) is exposed and a non-solder portion in which solder is not exposed. The image processing unit (62) uses the difference in reflectivity for the illumination light (612) between the solder portion (Eb) and the non-solder portion in order to extract the solder portion (Eb) from the image (g4). |
