发明名称 METHOD FOR MANUFACTURING ASSEMBLY AND METHOD FOR MANUFACTURING POWER-MODULE SUBSTRATE
摘要 A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a Cu-P-based brazing filler material containing 3 mass% to 10 mass% of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.
申请公布号 EP3041042(A1) 申请公布日期 2016.07.06
申请号 EP20140839742 申请日期 2014.08.18
申请人 MITSUBISHI MATERIALS CORPORATION 发明人 TERASAKI NOBUYUKI;NAGATOMO YOSHIYUKI
分类号 H01L23/12;B23K1/00;B23K35/02;B23K35/30;B23K35/362;C22C9/00;C22C9/02;C22C9/06;H01L21/48;H01L23/13;H01L23/36;H01L23/373 主分类号 H01L23/12
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