| 摘要 |
PROBLEM TO BE SOLVED: To prevent chips and cracks of a support substrate and separation of a protective film in a semiconductor element such as an LED element which uses a conductive support substrate, at the time of dicing cut of the semiconductor element.SOLUTION: In a semiconductor element, an eutectic junction layer and a protective film are not formed on cutting lines for dicing cut of the element thereby to prevent separation and chips of the eutectic junction layer and the protective film at a cut surface. In addition, by arranging a metal layer with less ductibility so as to cover an end of the protective film, chips and cracks of a support substrate and separation of the protective film in dicing are prevented. |
