发明名称 RELEASE FILM, METHOD FOR MANUFACTURING MOLDED ARTICLE, SEMICONDUCTOR COMPONENT, AND REFLECTOR COMPONENT
摘要 In the release film of the present invention, each of thermal shrinkage ratios in an MD direction and a TD direction at 120°C is not less than 5%.
申请公布号 EP3040174(A1) 申请公布日期 2016.07.06
申请号 EP20140844773 申请日期 2014.08.25
申请人 ASAHI KASEI CHEMICALS CORPORATION 发明人 KASAMATSU CHIKA;SUE KENICHIRO;MARUYAMA MUTSUHIRO;MATSUKI YUTAKA
分类号 B29C33/68;B29C55/28;B32B27/00;B32B27/32;C08J7/00 主分类号 B29C33/68
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