| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel method for producing a transparent conductive substrate capable of preventing reduction of adhesion strength of a base material with a transparent conductive layer and a pattern conductive layer, even if the transparent conductive layer and the pattern conductive layer are produced using such different production methods as an evaporation method and an application of a coating liquid, respectively.SOLUTION: A transparent conductive substrate is produced through: a step of preparing a transparent substrate having a primer layer obtained by curing a curable resin including a silane coupling agent on a transparent base material; a step of applying a coating liquid for forming a pattern conductive layer including a conductive metal or a conductive metal compound, on the primer layer, and desiccating the coating liquid thereafter so as to form a pattern conductive layer; and a step of vapor-depositing a transparent conductive metal oxide on the primer layer so as to form a transparent conductive layer. |
