MECHANICAL ASSEMBLY AND METHOD TO PROVIDE FORM-FACTOR AND WIRE ALIKE ADAPTATION OF EXISTING PLATFORM HARDWARE MODULES INTO NEW PRODUCTS
摘要
An Intelligent Electronic Device (IED) includes a plurality of hardware modules including a pair of analog input modules (AIM) modules, a Power Supply Module (PSM), and a Binary Input/Output (BIO) module. Each module is configured for mounting in a first IED housing that has a first form factor. The PSM and BIO module are constructed and arranged to directly connect with electrical connections of the first housing. A second IED housing is provided that has a second form factor that is different from the first form factor. The AIM modules are mounted to a bottom panel of the second housing. The PSM and the BIO module are mounted in the second housing. Wiring electrically connects the AIM modules to connections on the second housing. Adaptor structure electrically connects the PSM and the BIO module with associated connections of the second housing.
申请公布号
EP3039953(A1)
申请公布日期
2016.07.06
申请号
EP20140761931
申请日期
2014.08.26
申请人
ABB TECHNOLOGY AG
发明人
ISMAYILOV, SHAMSI;KHALIFA, YASER, A.;KOUDELKA, FRANTISEK;OKSENGORN, ARKADY;LAU, SIU;PATEL, HARDIK;CHOI, IN, Y.