| 摘要 |
PROBLEM TO BE SOLVED: To achieve downsizing and thinning of a semiconductor device.SOLUTION: A semiconductor package 6 of a flip-chip connection structure comprises: a semiconductor chip 1 including a principal surface 1a on which a plurality of electrode pads 1c are formed and a rear face 1b opposite to the principal surface 1a; four lead terminals 2 respectively including top faces 2a on which the semiconductor chip 1 is mounted and under surfaces 2b opposite to the top faces 2a; and an encapsulation body 4 including a principal surface 4a and a rear face 4b opposite to the principal surface 4a. By making a distance between first under surfaces 2c among under surfaces of four lead terminals 2 exposed on the rear face 4b of the encapsulation body 4 longer then a distance between the top faces 2a, generation of a solder bridge in solder bonding to a mounting substrate can be inhibited. As a result, reliability of the semiconductor package 6 can be improved while achieving downsizing and thinning of the semiconductor package 6. |
