发明名称 ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
摘要 Some embodiments relate to an electronic assembly including a plurality of electronic packages. The electronic assembly includes a frame, and a first electronic package mounted on the frame. The first electronic package includes a first pin grid array. The electronic assembly further includes a second electronic package mounted on the frame. The second electronic package includes a second pin grid array. The electronic assembly further includes an actuation mechanism on the frame. The actuation mechanism is configured to move the first electronic package and the second electronic package to the frame in the actuation of the actuation mechanism. So, the use of space can be optimized.
申请公布号 KR20160079644(A) 申请公布日期 2016.07.06
申请号 KR20150165545 申请日期 2015.11.25
申请人 INTEL CORPORATION 发明人 LLAPITAN DAVID J.;HEPPNER JOSHUA D.;LIU KUANG;SMALLEY JEFFORY L.;KRITHIVASAN VIJAYKUMAR;MURTAGIAN GREGORIO;CHAWLA GAURAV;THIBADO JONATHAN W.
分类号 H01L25/10;H01L23/482;H01L23/495;H01L25/065 主分类号 H01L25/10
代理机构 代理人
主权项
地址