| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrode member including a refrigerant passage which is less likely to short-circuit via a refrigerant.SOLUTION: The heat generated by a power semiconductor element is delivered to an electrode member 3 through a bonding material. The heat delivered to the electrode member 3 is diffused in the atmosphere through a heat exchange or the like via a refrigerant circulating in a refrigerant passage 7. The electrode member 3 which supplies power to the power semiconductor element includes the refrigerant passage 7 in which the refrigerant circulates in the inside thereof, and an insulating layer 9 which electrically insulates the refrigerant and the electrode member 3 in an inner wall of the refrigerant passage 7. |
