发明名称 転写成形方法、金型構造、転写成形装置、及び、光学部材
摘要 A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.
申请公布号 JP5949465(B2) 申请公布日期 2016.07.06
申请号 JP20120244004 申请日期 2012.11.05
申请人 オムロン株式会社 发明人 幕田 功;竹村 宏一;柴田 智英;山中 義久;北村 智和;篠原 正幸;廣田 和英;田口 善利;小島 正行;▲高▼橋 幸大
分类号 B29C59/02;B29C33/38;F21S2/00;G02B5/02;G02F1/13357 主分类号 B29C59/02
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