| 摘要 |
PROBLEM TO BE SOLVED: To provide a rework device of electronic component which makes a wiring board less likely to warp, when reworking an electronic component mounted on a wiring board, and to provide a rework method and a heat insulation cover member for rework device.SOLUTION: A rework device of electronic component for replacing an electronic component mounted on one side of a wiring board includes a preheater placed in a region on the other side of the wiring board facing the mounting region of a replaced electronic component, and a heat insulation cover member placed on one side of the wiring board and reducing heat dissipation from the outer periphery of the mounting region in one side of the wiring board, when the preheater is preheating. |
