| 摘要 |
An object of the present invention is to provide a method for manufacturing a metal-filled microstructure, capable of easily filling micropores with metal and suppressing the generation of residual stress caused by metal filling. A method for manufacturing a metal-filled microstructure according to the present invention includes: an anodic oxidation treatment step of anodically oxidizing a single surface of an aluminum substrate to form an anodic oxidation film on the single surface of the aluminum substrate, the anodic oxidation film including micropores, which are present in a thickness direction, and a barrier layer which is present in a bottom portion of the micropores; a barrier layer removal step of removing the barrier layer of the anodic oxidation film after the anodic oxidation treatment step; a metal filling step of filling the inside of the micropores with metal through an electroplating treatment after the barrier layer removal step; and a substrate removal step of removing the aluminum substrate to obtain a metal-filled microstructure after the metal filling step. |
