NEGATIVE-TYPE PHOTORESIST COMPOSITION

摘要

The present invention relates to a negative-type photoresist composition, and more specifically, to a negative-type photoresist composition comprising an alkali-soluble resin, a photopolymerizable compound, a photopolymerization initiator, a photoacid generator, and a monofunctional compound having at least one epoxy group, oxetane group, or vinyl ether group within a molecular structure. The composition does not control physical properties of a non-exposure part, but controls physical properties of an exposure part. The composition is capable of improving sensitivity by lowering developing properties of the exposure part. The composition solves a brittle problem that the exposure part is caked due to conventional crosslinking, and is capable of being desirably applied to a filed requiring flexibility since there is not an excessive increase in the curing extent after performing the post-bake process.