| 摘要 |
Provided is a polyimide film stacked body having high surface hardness, abrasion resistance, wear resistance, chemical resistance, durability, surface leveling properties, and heat resistance. The polyimide film stacked body is prepared by stacking a resin layer having a glass transition temperature of 250°C or more, and a polyimide film having a glass transition temperature of 230°C or more. The resin layer is obtained by curing a photocurable resin composition including a basket type silsesquioxane resin having photocurable properties. The ratio of the resin layer and the polyimide film (the thickness of the resin layer divided by the thickness of the polyimide film) is greater than or equal to 0.05, and less than or equal to 5.0. |
