ADHESIVE FILM AND METHOD FOR MANUFACTURING SEMINCONDUCTOR DEVICE

摘要

An adhesive film of the present invention includes a base material layer and a self-peeling adhesive layer laminated therein. The base material layer has a thermal contraction percentage in a direction of flow (thermal contraction percentage in an MD direction) and a thermal contraction percentage in an orthogonal direction with respect to the direction of flow (thermal contraction percentage in a TD direction) that satisfy the following conditions: (1) after heating at 150°C for 30 minutes, 0.4 ‰¤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ‰¤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ‰¤ 2%, and (2) after heating at 200°C for 10 minutes, 0.4 ‰¤ | thermal contraction percentage in MD direction / thermal contraction percentage in TD direction| ‰¤ 2.5 and average of thermal contraction percentage in MD direction and thermal contraction percentage in TD direction ‰¥ 3%.