| 摘要 |
A light emitting device of an embodiment includes a light emitting structure which includes first and second conductivity type semiconductor layers and an active layer arranged between the first and second conductivity type semiconductor layers, first and second electrodes which are respectively connected to the first and second conductivity type semiconductor layers, and a support member which covers and supports the first and second electrodes. The outside of the support member has a surface roughness of 0.1um to 1um. So, the light emitting device with low manufacturing costs and superior electric and optical properties can be provided. |
